Integrating MEMS/sensors with analog and digital functions toward instrumentation systems on a chip is a goal for many customers, since it offers the possibility of minimum cost and increased reliability.

An intelligent integrated system operating in the real analog world has at the centre the digital processing section that is characterised by low cost, high volume, small feature size technology, high speed, high density and must operate at low voltage, low power supply. Interface functions converts analog inputs to digital signals and physical, chemical properties into electrical signals.

SINTEF has focused the activities on the analog and mixed signal interface with the main objective to design mixed analog and digital application specific integrated circuits (ASICs) and to develop methods for integrating complex systems on a chip and on a single package system. Low power, low voltage, and low noise design techniques are employed for mixed analog and digital application specific circuits in fields such as high temperature, RF, intelligent integrated sensors, and instrumentation systems. ASIC package co-design is used for complex integrated systems. Analog and mixed signal design kits are available for different processes from different process houses. Analog and mixed signal IPs are available from a variety of sources. Technology files and design kits for a variety of Mentor Graphics tools are used for the design of the ASICs. The design team uses a mixed top down/bottom up ASIC design flow methodology for designing complex integrated electronics sytems on chip.

The ASICs and package systems are designed to operate beneath the sea in oil wells, and in medical and industrial applications.

For more information contact: Ovidiu Vermesan, Joar Martin Østby