Realising wireless integrated systems requires in many cases a multidisciplinary approach. Often more than one technology is involved and an integrated approach among microelectronics devices, communication technology, sensors/MEMS, packaging, testing and calibration is necessary.

The activities in SINTEF are concentrated on miniature front end integrated instrumentation systems (ASICs) capable of measuring/controlling different physical parameters, interpreting the data, and communicating with a remote/host system over a bidirectional wireless link. As such, the activities addresses the intersection of microelectronics, wireless communications, integrated and microelectromechanical systems (MEMS).

The design efforts are focusing on the use of low voltage deep submicron technology to achieve high functionality at very low power. The challenges are not only in low voltage mixed signal CMOS circuits but also in areas such as self test, low noise, power/energy management, and digital sensor compensation.

The optimum choice of technology and system supply voltage and the integration strategy sensor/MEMS, ASIC, digital processing and wireless communication involves a judicious trade-off considering cost, flexibility and desired/achievable overall system performance and resolution.

For more information contact: Ovidiu Vermesan, Joar Martin Østby